Defense Advanced Research Projects Agency (DARPA) officials are espousing the benefits of the 2023 Electronics Resurgence Initiative (ERI) Summit, noting the effort would address noteworthy microelectronics innovation advances.
The theme of the event is Reinventing Domestic Microelectronics Manufacturing. It is slated for Aug. 22-24 in Seattle, Wash., and will convene experts in microelectronics and semiconductors for crucial conversations and a robust showcase.
“ERI 2.0 is aimed at both national security capabilities and commercial economic competitiveness,” DARPA Director for ERI Special Assistant Carl McCants said. “It’s a thematic portfolio of research programs to ensure U.S. leadership in next-generation microelectronics research, development, and manufacturing. New methods for designing, fabricating, packaging, and testing these imminently disruptive technologies are essential to U.S. resilience and competitiveness. At this moment of inflection, success hinges on the combined and coordinated efforts of all us in industry, in academia, and in government.”
The offering will provide a central platform for discussing ERI 2.0, aiming to further advance ERI’s foundational thrusts while pursuing future-focused manufacturing capabilities for complex, 3D microsystems and hardened electronics for extreme environments.
Event registration will open May 15. Early registration is recommended.