Lockheed Martin recently announced plans to collaborate with Intel Corporation and Altera for the Office of the Under Secretary of Defense for Research and Engineering’s (OUSD R&E) STAMP program and its airborne electronic defense system.
STAMP, or Stimulating Transition for Advanced Microelectronics Packaging, will see Lockheed Martin develop a low size, weight and power Sensor Open System Architecture (SOSA) aligned airborne electronic defense system. This will couple with Altera’s Multi-Chip Package for use in the U.S. Navy’s MH-60R multi-mission helicopter.
According to John Sotir, senior director of military aerospace and government business and State-of-the-Art Heterogeneous Integration Packaging (SHIP) at Altera, collaboration with Lockheed should allow for rapid development of vital defense systems with higher bandwidth and performance at lower latency levels, lower power and smaller overall footprints.
“We are excited to work with Intel, Altera, and OUSD to provide a revolutionary leap in defense systems capabilities, utilizing high-performance U.S.-built semiconductors,” Deon Viergutz, vice president of spectrum convergence at Lockheed Martin, said. “In the modern battlespace, against modern threats, this technology will be essential to the evolution of legacy systems and development of new systems that keep service members safe by controlling the electromagnetic spectrum and staying ahead of the threat.”
Lockheed Martin’s latest SOSA technology will integrate with Altera’s semiconductors over the next 18 months, through work performed in New York. Technology originally developed under STAMP for the Sikorsky MH-60R helicopter could also be eventually applied across platforms in the air, by land and on the sea.
The Naval Surface Warfare Center (NSWC) Crane Division Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) awarded the project to these companies through an Other Transaction Agreement vehicle that will be managed by the National Security Technology Accelerator (NSTXL).